Our plasma surface treatment technology for activation, cleaning and coating is already the standard for many applications in the electronics industry. For example, Openair-Plasma® is already used to improve the adhesion of conformal coatings. However, we are always looking to develop new applications and improve existing technologies and systems.
For example, our newest technology is called HydroPlasma. It can be used to remove inorganic contaminants, such as flux residues from metal surfaces. Secondly, we are introducing a dielectric barrier nanocoating that can be applied with our PlasmaPlus® coating process, especially on small electronic circuit boards for wearables. The huge advantage here is the ideal thermal conductivity due to its very thin properties. We are talking about a 800 -1200 nm coating that can be applied very selectively.
Starting in mid-January, we will present a new application for our REDOX®-Tool. In addition to the inline reduction of oxide layers in the production process of power modules, we will now introduce this tool to produce lead frames. By reducing oxide layers from lead frames, we can achieve a throughput of up to 850 UPH. The tool will be available at our Singapore subsidiary for customer demonstration throughout the year.
Finally, we are launching our latest jet technology, a particle-free jet, called PFA10, which can also be used in the semiconductor industry. With this jet, we can realize a copper oxide reduction process to achieve the strongest adhesion force for the hybrid bonding process.
